In the November 2025 issue of the IEEE Spectrum magazine, read the special issue exploring the thermal challenges shaping the future of computing and four big ideas to cool things down.
Future Chips Will Be Hotter Than Ever
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“Diamonds, lasers, and oil aren't the first things you may think of when considering ways to keep chips and computers cool. But as modern chip designs pack and stack more transistors into ever smaller spaces, heat has emerged as a critical problem...” |
Diamond Blankets Will Keep Future Chips Cool
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“A micrometers-thick integrated layer spreads out the heat. This breakthrough could be a potentially transformative solution for RF systems, allowing them to operate at higher power than ever before…” |
Next-Gen AI Needs Liquid Cooling
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“Which method will end up being the industry standard for the high-end AI factories of the future? At this point, it’s anyone’s guess. Here’s how the four methods work, and where they might find the most use...” |
You Can Cool Chips With Lasers?!?!
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“Startup plans to cool data centers by converting heat to light. For years, the industry has battled this thermal limit with bigger fans and more complex liquid cooling systems. But these are fundamentally Band-Aid solutions…” |
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