AI Applications in Semiconductor Packaging is a two-hour course program that provides a practical overview of AI-driven approaches to packaging reliability, covering machine learning, neural networks, anomaly detection, digital twins, and failure prediction.
Innovation Spotlight
December 2, 2024
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In the December issue of the IEEE Spectrum magazine, read about the race to save submarine stealth in an age of AI surveillance, Google's decade-long quest to advance nuclear energy, how to speed up chip design, and more!
March 6, 2024
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In the March issue of the IEEE Spectrum magazine, read about the science and sci-fi of a really big computer, the ultimate power transistor, DNA as data storage, and more!
June 14, 2023
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In the June issue of the IEEE Spectrum magazine, read about the great AI treasure hunt, the next chip industry workforce, the race to catch the Mirai Botnet creators, and more.
August 1, 2020
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In the August issue of the IEEE Spectrum Magazine, read about how AI will revolutionize forestry, no more zombie satellites, the false crisis in semiconductors, the inside story of the arpanet, why space radios need to be smart, and more.
