AI Applications in Semiconductor Packaging is a two-hour course program that provides a practical overview of AI-driven approaches to packaging reliability, covering machine learning, neural networks, anomaly detection, digital twins, and failure prediction.
Innovation Spotlight
January 22, 2026
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From Research to Publication: A Step-by-Step Guide to Technical Writing exposes learners to writing methods, expectations, and traditions used for creating technical, scientific journal articles, or reports in English. The course offers in-depth overviews, discussing the traditional format and expectations of a technical or scientific article, such as those found in IEEE journals.
January 13, 2026
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In the January 2026 issue of the IEEE Spectrum magazine, read about the top tech to watch out for in 2026.
December 15, 2025
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The IEEE Xplore team has developed an analysis detailing all of the top technologies searched and articles downloaded by millions of IEEE Xplore users in 2025!
December 15, 2025
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In the December issue of the IEEE Spectrum magazine, read about Hyundai's massive metaplant, Qualcomm's plans for Arduino, LLMs that fit in a laptop, why software fails, and more.
November 21, 2025
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As IEEE celebrates a new milestone—eclipsing 7 million total documents hosted in the IEEE Xplore Digital Library—we take a moment to thank our many authors, members, volunteers, and subscribers for making this moment possible and reflect on how IEEE Xplore has evolved to support the needs of users all over the world.
November 11, 2025
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In the November issue of the IEEE Spectrum magazine, read the special issue exploring the thermal challenges shaping the future of computing and four big ideas to cool things down.
October 27, 2025
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October 16, 2025
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As a supporter of open science, IEEE joins in the celebration of International Open Access Week from Monday, October 20th through Sunday, October 26th.
October 10, 2025
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In the October issue of the IEEE Spectrum magazine, read about humanity’s greatest challenges that require us to radically scale up our ingenuity. From football field sized airplanes, to the future of humanoid robotics, this special issue dives into the marvels and risks of scaling technology to meet our future.
